iPhone 18: an A20 chip with multiple advantages
In a publication by the leaker Phone Chip Expert on the social network Weibo, we learn that the architecture of the latter would evolve, moving from the InFo (Integrated Fan-Out) packaging method to WMCM (Wafer-Level Multi-Chip Module ).
Reporting this information, MacRumors points out that this new technology would allow Apple to gain flexibility regarding the arrangement of certain components of the A20 chip, such as CPUs, GPUs, DRAM and other custom accelerators.
“It offers greater flexibility in the arrangement of different types of chips, by stacking them vertically or placing them side by side, while optimizing communication between them”*, adds the specialist Apple media. This would allow them to carry out operations more quickly and consume less energy.
We can also read that the A19 would be engraved in 2 nm, an engraving finesse which is already expected for the chip of the next generation of Apple smartphones, the iPhone 17. Potentially exclusive to Pro models, engraving could improve on the A20 of the iPhone 18, thus delivering improved performance and energy efficiency, and extending to standard models.
In addition to this change in the structure of the chip, the informant adds that 12 GB of RAM would be included in the iPhone 18. A development which is already expected for at least one iPhone 17 Pro next year, and which would allow all models to benefit from more advanced Apple Intelligence features.
